NIST Purchases SSTR-F from Laser Thermal to Support CHIPS for America Program

Laser Thermal has secured a contract with the National Institute of Standards and Technology (NIST) for its thermal conductivity tool, Steady State Thermoreflectance in Fiber (SSTR-F). This tool assists in measuring the thermal conductivity of power electronics materials, packaging materials, and integrated chip components. The purchase supports the CHIPS for America thermal property metrology program.

The CHIPS Metrology Program focuses on precise and fit-for-purpose measurements for microelectronic materials. NIST aims to address metrology challenges across industry, academia, and government agencies through this program. The SSTR-F tool allows for non-contact, non-destructive, and spatially resolved measurements, providing crucial data on thin films and multilayer structures.

Laser Thermal's CEO, John Gaskins, highlighted the company's achievement in commercializing a thermoreflectance instrument. The tool leverages patented technology, enabling direct measurements of thermal properties typically difficult to obtain outside academic settings. This collaboration aims to enhance metrology for microelectronics manufacturing and standardize reference materials for thin films.

As NIST expands its thermal metrology capabilities, the SSTR-F tool will remain essential. It will contribute to providing data, protocols, and reference standards, guiding the semiconductor industry's focus on thermal mitigation amidst increasing power demands from applications like AI and data centers.