News
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PRESS RELEASE
Hyundai Mobis and Qualcomm Sign Comprehensive Agreement to Collaborate on SDV architecture for ADAS
Hyundai Mobis and Qualcomm sign a comprehensive agreement at CES 2026 to collaborate on SDV architecture for ADAS, aiming to enhance performance and efficiency for advanced driver assistance systems -
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PRESS RELEASE
Hyundai Mobis to Unveil 30+ New Technologies at CES 2026, Aiming to Strengthen Global OEM Partnerships
Hyundai Mobis to present 30+ new technologies at CES 2026, including innovative M.VICS 7.0 cockpit and X-by-Wire chassis solutions, winning CES Innovation Award for Holographic Windshield Display -
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